CVE-2023-33063 — Qualcomm Multiple Chipsets Use-After-Free Vulnerability
2023-12-05 • CISA Known Exploited Vulnerability
[event] Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
> AFFECTED SOFTWARE
| Field | Value |
|---|---|
| Vendor | Qualcomm |
| Product | Multiple Chipsets |
| CWE | CWE-416 |
| CVE ID | CVE-2023-33063 |
| Date Added | 2023-12-05 |
| Due Date | 2023-12-26 |
| Ransomware Campaign | Unknown |
> MITIGATION
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Due Date: 2023-12-26